Best-selling ZX-X5 BGA rework system

ZX-X5 BGA rework system
Three indepedent heater
Optical alignment
Connect with computer
For computer and laptop motherboard
ZX-X5 BGA rework system
Features
1. HD optical alignment system design,optical zoom up to 22 times;
2.Alignment fine-tuning accuracy can be 0.01mm;
3.Upper heater with hot air, bottom with hot air and IR to preheat;
4.Upper and bottom heater controlled by 8 segment temperature up (down)+8 segment constant temperature, can store 10 groups temperature profile;
5.Three heating zone with independent PID to control heating process, more stable and accurate;
6.Bottom heater and IR preheating zone with supporter to prevent welding zone part deformation;
7.After removal and welding with cooling fan to cool PCB board, ensure welding effect;
8.Equipped with various size of hot air nozzle;
9.Upper and bottom heater can 360 degree rotation, easy to replace;
10.Build-in vacuum pump, no need gas source.

Specifications
PCB Size
≤L565×W510mm
PCB Thickness
0.1~5mm
Temperature Control
K thermocouple,closed
Fine-tuning accuracy
0.01mm
PCB Positioning
Outer
Sub (Bottom) heater
Infrared 2400W
Main (Top+bottom) heater
Hot air 800W+800W
Power supply
Single phase 220V,50/60Hz,4.0KVA
Machine dimension
L700*W725*H960mm
Weight of machine
Approx. 90kgs